Advanced semiconductor packaging technologies like 2.5D and 3D hybrid bonding, along with emerging solutions like silicon photonics, are critical in optimizing system performance and fostering the next wave of AI and HPC chip innovation. The “Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications” report recently published by IDTechEx explores the evolving landscape of semiconductor packaging, with a focus on 2.5D and 3D hybrid bonding packaging. It covers technology trends, industry challenges, and the advancements made by...