Samsung Electronics Co., Ltd., a world leader in advanced memory technology, today announced that it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM1 using 12 nanometer (nm)-class process technology. This achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung’s leadership in next-generation DRAM technology and signals the next chapter of high-capacity memory. “With our 12nm-class 32Gb DRAM, we have secured a solution that...